Electrochemical Synthesis of Nanocrystalline CuAg Coatings on Stainless Steel from Cyanide-Free Electrolyte

Herein we demonstrate a novel plating bath, free from cyanide, to plate highly adherent nanocrystalline copper-silver (ncCuAg) coating on stainless-steel substrate and its application as an antimicrobial coating. The microstructures, such the grain size, texture, microstrain, crystalline preferential orientation of CuAg deposits, are systematically investigated by X-ray diffraction analysis. range 13.4–16.6 nm was discovered be crystallite size determined peak broadening (Scherrer’s formula). Both HRTEM, FESEM-EDS, XPS, mapping analysis revealed that ncCuAg coatings composed both Ag Cu atoms. Electrochemical processes occurring during co-deposition were using linear sweep voltammetry (LSV), cyclic (CV), anodic stripping (ALSV). Additionally, made produced these baths work well antibacterial agents against gram-positive (Staphylococcus) gram-negative bacteria (Escherichia coli).